In 2022, Kenya scored **** points in the Human Development Index (HDI), which indicated a medium level of development. An overall improvement was recorded from 2000 onwards. That year, Kenya's score was ****, meaning that the country had a low level of human development. The categorization changed from low to medium in 2008; however, it fell back into the low HDI category the following year. Since 2010, Kenya has remained in the medium category.

Administrative unitsRepresents the administrative units used for GDP per capita (PPP) and HDI data products. National administrative units have id 1-999, sub-national ones 1001-admin_areas_GDP_HDI.ncGDP_per_capita_PPP_1990_2015The GDP per capita (PPP) dataset represents average gross domestic production per capita in a given administrative area unit. GDP is given in 2011 international US dollars. Gap-filled sub-national data were used, supplemented by national data where necessary. Datagaps were filled by using national temporal pattern. Dataset has global extent at 5 arc-min resolution for the 26-year period of 1990-2015. Detail description is given in a linked article and metadata is provided as an attribute in the NetCDF file itself.GDP_PPP_1990_2015_5arcminThis global dataset represents the gross domestic production (GDP) of each grid cell. GDP is given in 2011 international US dollars. The data is derived from GDP per capita (PPP) which is multiplied by gridded population data HYDE 3.2 (the years of population data not available (1991-1999) were linearly interpolated at grid scale based on data from years 1990 and 2000). Dataset has global extent at 5 arc-min resolution for the 26-year period of 1990-2015. Detail description is given in a linked article and metadata is provided as an attribute in the NetCDF file itself.HDI_1990_2015HDI is a composite index of average achievement in key dimensions of human development (dimensionless indicator between 0 and 1). This index is based on method introduced 2010 and updated 2011. The subnational data for HDI were collected from multiple national-level datasets, and national-level HDI was collected from UNDP. Years with missing data were interpolated over time thin plate spines, assuming smooth trend over time. The dataset has a global extent at 5 arc-min resolution, and the annual data is available for each year over 1990-2015. HDI sub-national data covers 39 countries and 66% of global population in 2015.pedigree_GDP_per_capita_PPP_1990_2015This is the source data for GDP per capita (PPP), published as an indication of accuracy and precision. Reports the scale (national, sub-national) and type (reported, interpolated, extrapolated) of each year of data. Detail description is given in a linked article and metadata is provided as an attribute in the NetCDF file itself.pedigree_HDI_1990_2015This is the source data for Human Development Index (HDI), published as an indication of accuracy and precision. Reports the scale (national, sub-national) and type (reported, interpolated, extrapolated) of each year of data. Detail description is given in a linked article and metadata is provided as an attribute in the NetCDF file itself. Detail description is given in a linked article and metadata is provided as an attribute in the NetCDF file itself.GDP_PPP_30arcsecThe GDP (PPP) data represents average gross domestic production of each grid cell. GDP is given in 2011 international US dollars. The data is derived from GDP per capita (PPP), which is multiplied by gridded population data from Global Human Settlement (GHS). Dataset has a global extent at 30 arc-second resolution for three time steps: 1990, 2000, and 2015. Detail description is given in a linked article and metadata is provided as an attribute in the NetCDF file itself.kummu_etal_scidata_codeThis file contains the scripts for data handling and production An increasing amount of high-resolution global spatial data are available, and used for various assessments. However, key economic and human development indicators are still mainly provided only at national level, and downscaled by users for gridded spatial analyses. Instead, it would be beneficial to adopt data for sub-national administrative units where available, supplemented by national data where necessary. To this end, we present gap-filled multiannual datasets in gridded form for Gross Domestic Product (GDP) and Human Development Index (HDI). To provide a consistent product over time and space, the sub-national data were only used indirectly, scaling the reported national value and thus, remaining representative of the official statistics. This resulted in annual gridded datasets for GDP per capita (PPP), total GDP (PPP), and HDI, for the whole world at 5 arc-min resolution for the 25-year period of 1990–2015. Additionally, total GDP (PPP) is provided with 30 arc-sec resolution for three time steps (1990, 2000, 2015).

In sub-Saharan Africa, a score of around 0.57 was achieved on the Human Development Index (HDI) in 2023. This represented a low level of human development. In 2018, the sub-region moved from being categorized as low human development to medium human development.

Korea HDI: Seoul data was reported at 93.379 Score in Jun 2018. This records an increase from the previous number of 93.130 Score for May 2018. Korea HDI: Seoul data is updated monthly, averaging 95.173 Score from Jul 2012 (Median) to Jun 2018, with 72 observations. The data reached an all-time high of 106.640 Score in Jul 2017 and a record low of 68.742 Score in Jul 2012. Korea HDI: Seoul data remains active status in CEIC and is reported by Korea Appraisal Board. The data is categorized under Global Database’s Korea – Table KR.EB053: Housing Demand Index.

Korea HDI: Sejong data was reported at 106.358 Score in Jun 2018. This records an increase from the previous number of 106.214 Score for May 2018. Korea HDI: Sejong data is updated monthly, averaging 101.667 Score from Dec 2012 (Median) to Jun 2018, with 67 observations. The data reached an all-time high of 122.472 Score in Jul 2017 and a record low of 87.198 Score in Jan 2015. Korea HDI: Sejong data remains active status in CEIC and is reported by Korea Appraisal Board. The data is categorized under Global Database’s Korea – Table KR.EB053: Housing Demand Index.

Korea HDI: Incheon data was reported at 92.867 Score in Jun 2018. This records an increase from the previous number of 92.832 Score for May 2018. Korea HDI: Incheon data is updated monthly, averaging 94.030 Score from Jul 2012 (Median) to Jun 2018, with 72 observations. The data reached an all-time high of 100.927 Score in Nov 2017 and a record low of 59.404 Score in Jul 2012. Korea HDI: Incheon data remains active status in CEIC and is reported by Korea Appraisal Board. The data is categorized under Global Database’s Korea – Table KR.EB053: Housing Demand Index.

The High-Density Interconnect (HDI) PCB market is experiencing robust growth, projected to reach $11.1 billion in 2025 and maintain a Compound Annual Growth Rate (CAGR) of 6.2% from 2025 to 2033. This expansion is fueled by the increasing demand for miniaturized and high-performance electronics across diverse sectors. The consumer electronics segment, driven by the proliferation of smartphones, wearables, and advanced computing devices, is a significant contributor to market growth. Furthermore, the aerospace and defense, telecom and IT, and automotive industries are adopting HDI PCBs to accommodate increasingly complex circuitry and higher data transmission speeds. Technological advancements in HDI PCB manufacturing, such as the development of HDI PCB Type 3 with its superior density and performance capabilities, are further stimulating market expansion. While supply chain constraints and fluctuating raw material prices pose challenges, the long-term outlook for the HDI PCB market remains positive, underpinned by continuous innovation and the growing adoption of advanced electronic devices. The geographical distribution of the HDI PCB market reflects the concentration of manufacturing and technological hubs. Asia-Pacific, particularly China, is expected to dominate the market due to its substantial manufacturing base and the presence of key players. North America and Europe will also exhibit significant growth, driven by strong demand from consumer electronics and automotive industries. However, emerging markets in regions like South America, the Middle East & Africa, and other parts of Asia are presenting promising opportunities for market expansion. The competitive landscape is characterized by both established global players and regional manufacturers, leading to intense competition and ongoing technological advancements. The market's segmentation by application and type allows for a granular understanding of specific growth drivers within each sector, enabling targeted strategies for market penetration and expansion.

According to the results of a global survey held in 2023, consumers in countries with a lower HDI were the most likely to rely on social media feeds to get their news, with ** percent saying that they primarily got news from social networks. They were also the least likely consumers to use radio, television, or media websites and apps as their main news source. By contrast, countries with very high HDIs mostly got news via TV, and radio remained a relatively popular option with over ** percent using the medium as their primary news source.

The global HDI PCB market for consumer electronics is experiencing robust growth, driven by the increasing demand for miniaturized and high-performance electronic devices. The market, estimated at $5 billion in 2025, is projected to maintain a healthy Compound Annual Growth Rate (CAGR) of around 8% from 2025 to 2033, reaching approximately $9 billion by 2033. This expansion is fueled by several key factors: the proliferation of smartphones with advanced features, the rise of wearable technology requiring intricate and dense circuitry, and the growing adoption of high-resolution displays and sophisticated cameras in consumer electronics. Furthermore, the ongoing trend towards thinner and lighter devices necessitates the use of HDI PCBs, which offer superior density and miniaturization capabilities compared to traditional PCBs. Leading manufacturers such as Tripod Technology, AT&S, and TTM Technologies are actively investing in advanced HDI manufacturing technologies to meet this rising demand, while emerging players in regions like Asia are also contributing to the market's competitive landscape. However, the market's growth is not without challenges. Supply chain disruptions, fluctuating raw material prices, and the increasing complexity of HDI PCB manufacturing pose significant restraints. Moreover, the stringent regulatory requirements for environmental compliance and the need for continuous innovation in materials and manufacturing processes represent ongoing hurdles for market participants. Despite these challenges, the long-term outlook for the HDI PCB market in consumer electronics remains positive, driven by the sustained demand for feature-rich and compact electronic devices across the globe. Market segmentation by application (smartphones, wearables, tablets, etc.) and region (North America, Asia-Pacific, Europe, etc.) will further reveal nuanced growth patterns and investment opportunities.

Human development index of Solomon Islands decreased by 0.35% from 0.57 score in 2019 to 0.57 score in 2020. Since the 0.71% rise in 2018, human development index remained constant by 0.00% in 2020. A composite index measuring average achievement in three basic dimensions of human development—a long and healthy life, knowledge and a decent standard of living

Korea Housing Demand Index (HDI) data was reported at 90.853 Score in Jun 2018. This records a decrease from the previous number of 91.638 Score for May 2018. Korea Housing Demand Index (HDI) data is updated monthly, averaging 97.197 Score from Jul 2012 (Median) to Jun 2018, with 72 observations. The data reached an all-time high of 103.411 Score in Nov 2015 and a record low of 81.630 Score in Jul 2012. Korea Housing Demand Index (HDI) data remains active status in CEIC and is reported by Korea Appraisal Board. The data is categorized under Global Database’s Korea – Table KR.EB053: Housing Demand Index.

High-density Interconnect (HDI) Market Outlook

According to our latest research, the global High-density Interconnect (HDI) market size in 2024 stands at USD 16.7 billion, demonstrating robust expansion driven by surging demand across multiple industries. The market is advancing at a notable CAGR of 11.3% from 2025 to 2033. By 2033, the HDI market is forecasted to reach a valuation of approximately USD 44.2 billion, propelled by technological advancements, miniaturization trends, and the proliferation of electronic devices. The primary growth factor is the rising integration of HDI PCBs in consumer electronics, automotive, and telecommunications, which is reshaping the global electronics manufacturing landscape.

The growth trajectory of the High-density Interconnect (HDI) market is significantly influenced by the relentless drive for miniaturization and enhanced performance in electronic devices. The evolution of smartphones, tablets, wearables, and IoT devices has led to an increasing need for compact, lightweight, and high-functionality PCBs. HDI technology, with its ability to accommodate more components in smaller footprints, enables manufacturers to achieve these objectives efficiently. Additionally, the transition to 5G networks and the ongoing digital transformation in various sectors have further underscored the necessity for advanced interconnect solutions, thereby driving the adoption of HDI PCBs globally. The market’s expansion is also buoyed by the growing investments in research and development, which are yielding new materials and manufacturing processes, thus improving the reliability and performance of HDI products.

Another key driver accelerating the HDI market is the burgeoning automotive electronics sector. Modern vehicles are increasingly equipped with sophisticated infotainment systems, advanced driver assistance systems (ADAS), and a multitude of sensors, all of which require compact and robust electronic assemblies. HDI PCBs offer higher wiring density and improved electrical performance, making them an ideal choice for automotive applications where space constraints and reliability are paramount. The electrification of vehicles, coupled with the rising adoption of autonomous driving technologies, is expected to further amplify the demand for HDI solutions in the automotive industry. Moreover, the healthcare sector’s growing reliance on compact medical devices and diagnostic equipment is contributing to the market’s upward momentum, as HDI technology enables the development of smaller, more efficient, and reliable electronics for critical medical applications.

The industrial electronics and IT & telecommunications sectors are also playing a pivotal role in shaping the HDI market landscape. Industrial automation, the Industrial Internet of Things (IIoT), and the deployment of smart manufacturing solutions necessitate advanced electronic systems that can operate reliably in demanding environments. HDI PCBs, with their superior signal integrity, reduced electromagnetic interference, and enhanced thermal management, are increasingly being adopted in industrial control systems, robotics, and communication infrastructure. Furthermore, the rapid expansion of data centers and the growing need for high-speed data transmission are driving the demand for HDI technology in the IT & telecommunications domain. These trends collectively underscore the market’s resilience and its capacity to adapt to the evolving requirements of diverse end-user industries.

From a regional perspective, Asia Pacific remains the dominant force in the global HDI market, accounting for the largest share in 2024. This dominance is attributed to the presence of leading electronics manufacturing hubs in China, Japan, South Korea, and Taiwan, coupled with the region’s robust supply chain and cost-effective production capabilities. North America and Europe are also significant contributors, driven by technological innovation and strong demand from the automotive, healthcare, and industrial sectors. The Middle East & Africa and Latin America, while currently holding smaller shares, are witnessing steady growth due to increasing investments in telecommunications infrastructure and rising adoption of advanced electronics. The regional outlook for the HDI market is characterized by dynamic growth patterns, with Asia Pacific projected to maintain its leadership position throughout the forecast period.

Human development index of Guinea Bissau decreased by 1.23% from 0.49 score in 2019 to 0.48 score in 2020. Since the 2.55% rise in 2018, human development index remained constant by 0.00% in 2020. A composite index measuring average achievement in three basic dimensions of human development—a long and healthy life, knowledge and a decent standard of living

Korea HDI: Busan data was reported at 76.649 Score in Jun 2018. This records a decrease from the previous number of 77.919 Score for May 2018. Korea HDI: Busan data is updated monthly, averaging 97.373 Score from Jul 2012 (Median) to Jun 2018, with 72 observations. The data reached an all-time high of 109.556 Score in Nov 2016 and a record low of 64.941 Score in Jul 2012. Korea HDI: Busan data remains active status in CEIC and is reported by Korea Appraisal Board. The data is categorized under Global Database’s Korea – Table KR.EB053: Housing Demand Index.

The Flex HDI PCB market is experiencing robust growth, driven by increasing demand for miniaturized and high-performance electronic devices across diverse sectors. The proliferation of smartphones, wearables, and advanced automotive electronics necessitates flexible and intricate circuit boards capable of handling complex functionalities within compact spaces. This demand fuels a significant expansion of the market, with a projected Compound Annual Growth Rate (CAGR) – let's assume a conservative estimate of 15% – based on recent market trends and technological advancements. Key players like Unimicron, AT&S, and Samsung Electro-Mechanics are at the forefront of this growth, investing heavily in research and development to enhance manufacturing capabilities and introduce innovative solutions. The market is segmented based on application (consumer electronics, automotive, healthcare, etc.) and geography, with Asia-Pacific expected to dominate due to the concentration of manufacturing hubs and high consumer electronics adoption rates. Growth is further fueled by continuous advancements in materials science and manufacturing processes, leading to improved flexibility, durability, and performance of Flex HDI PCBs. However, challenges remain, including the high initial investment costs associated with advanced manufacturing equipment and stringent quality control requirements. Furthermore, the market faces potential restraints from fluctuations in raw material prices and the emergence of alternative interconnect technologies. Nevertheless, the overall market outlook remains positive, with sustained growth anticipated through 2033, driven by the unrelenting demand for smaller, faster, and more powerful electronics in a wide range of applications. Competition is intense, with established players constantly striving for market share alongside emerging companies leveraging innovative technologies.

The global High-Density Interconnect (HDI) market, valued at $11.97 billion in 2025, is projected to experience steady growth, exhibiting a Compound Annual Growth Rate (CAGR) of 1.4% from 2025 to 2033. This relatively moderate growth reflects a mature market, yet significant opportunities remain within specific segments and geographical regions. Driving this expansion are advancements in miniaturization within consumer electronics, particularly in smartphones and wearable technology, demanding increasingly complex and compact circuit boards. The rise of 5G telecommunications infrastructure also fuels demand for HDI PCBs capable of handling high-speed data transmission. Furthermore, the automotive industry's adoption of advanced driver-assistance systems (ADAS) and electric vehicles (EVs) creates a substantial need for high-performance HDI solutions. However, market growth is tempered by the cyclical nature of the electronics industry, economic fluctuations, and potential supply chain disruptions. The increasing complexity of HDI manufacturing, leading to higher production costs, also presents a restraint. Market segmentation reveals significant disparities in growth rates among applications and PCB types. While the consumer electronics segment currently dominates, the automotive sector is expected to exhibit the most robust growth in the forecast period due to increasing electronic content in vehicles. Similarly, HDI PCB (2+N+2) technology, offering higher density and performance, is anticipated to outpace other types in terms of market share expansion. Leading players like Unimicron, Compeq, AT&S, and Ibiden are actively engaged in technological advancements and strategic partnerships to maintain competitiveness. Geographic distribution shows considerable concentration in Asia-Pacific, primarily driven by China and South Korea, the world's manufacturing hubs for consumer electronics. However, North America and Europe are expected to maintain a steady market share due to strong demand for high-tech products and robust automotive industries. Successful strategies for market penetration will require a focus on innovation in materials and manufacturing processes, coupled with a geographically diversified approach to mitigate risks associated with regional economic fluctuations and supply chain vulnerabilities. The long-term outlook suggests continued, albeit measured, expansion driven by technological advancements and sustained demand from key application sectors.

Human development index of Bosnia and Herzegovina decreased by 0.51% from 0.78 score in 2019 to 0.78 score in 2020. Since the 0.26% rise in 2018, human development index remained constant by 0.00% in 2020. A composite index measuring average achievement in three basic dimensions of human development—a long and healthy life, knowledge and a decent standard of living

BackgroundThe development of cognitive and socioemotional skills early in life influences later health and well-being. Existing estimates of unmet developmental potential in low- and middle-income countries (LMICs) are based on either measures of physical growth or proxy measures such as poverty. In this paper we aim to directly estimate the number of children in LMICs who would be reported by their caregivers to show low cognitive and/or socioemotional development.Methods and FindingsThe present paper uses Early Childhood Development Index (ECDI) data collected between 2005 and 2015 from 99,222 3- and 4-y-old children living in 35 LMICs as part of the Multiple Indicator Cluster Survey (MICS) and Demographic and Health Surveys (DHS) programs. First, we estimate the prevalence of low cognitive and/or socioemotional ECDI scores within our MICS/DHS sample. Next, we test a series of ordinary least squares regression models predicting low ECDI scores across our MICS/DHS sample countries based on country-level data from the Human Development Index (HDI) and the Nutrition Impact Model Study. We use cross-validation to select the model with the best predictive validity. We then apply this model to all LMICs to generate country-level estimates of the prevalence of low ECDI scores globally, as well as confidence intervals around these estimates.In the pooled MICS and DHS sample, 14.6% of children had low ECDI scores in the cognitive domain, 26.2% had low socioemotional scores, and 36.8% performed poorly in either or both domains. Country-level prevalence of low cognitive and/or socioemotional scores on the ECDI was best represented by a model using the HDI as a predictor. Applying this model to all LMICs, we estimate that 80.8 million children ages 3 and 4 y (95% CI 48.1 million, 113.6 million) in LMICs experienced low cognitive and/or socioemotional development in 2010, with the largest number of affected children in sub-Saharan Africa (29.4.1 million; 43.8% of children ages 3 and 4 y), followed by South Asia (27.7 million; 37.7%) and the East Asia and Pacific region (15.1 million; 25.9%). Positive associations were found between low development scores and stunting, poverty, male sex, rural residence, and lack of cognitive stimulation. Additional research using more detailed developmental assessments across a larger number of LMICs is needed to address the limitations of the present study.ConclusionsThe number of children globally failing to reach their developmental potential remains large. Additional research is needed to identify the specific causes of poor developmental outcomes in diverse settings, as well as potential context-specific interventions that might promote children’s early cognitive and socioemotional well-being.

The global market for High-Density Interconnect (HDI) Printed Circuit Boards (PCBs) in consumer electronics is experiencing robust growth, driven by the increasing demand for smaller, faster, and more feature-rich devices. The market, currently valued at approximately $15 billion in 2025, is projected to exhibit a Compound Annual Growth Rate (CAGR) of 8% from 2025 to 2033, reaching an estimated $28 billion by 2033. This expansion is fueled by several key factors. The proliferation of smartphones, tablets, and laptops with advanced functionalities, coupled with the rising popularity of wearable technology like smartwatches and fitness trackers, significantly boosts HDI PCB demand. Miniaturization trends in electronics necessitate HDI PCBs' high component density and intricate designs, making them indispensable for these applications. Technological advancements in HDI PCB manufacturing processes, such as advancements in materials and automated production techniques, further contribute to market growth by improving quality and lowering costs. However, challenges such as fluctuating raw material prices and the complexity of HDI PCB manufacturing remain potential restraints. Segmentation within the market reveals significant variations across application types (smartphones/tablets/laptops holding the largest share) and HDI PCB types (with Type 1 dominating due to its versatility and cost-effectiveness). Key players are leveraging technological advancements and strategic partnerships to maintain their competitive edge within this dynamic landscape. The regional landscape demonstrates significant variations in HDI PCB market penetration. Asia-Pacific, particularly China, holds a substantial market share, driven by large-scale manufacturing and substantial consumer electronics production. North America and Europe follow, exhibiting strong growth potential due to technological innovation and high adoption rates of advanced consumer electronics. However, emerging economies in regions like South America, the Middle East, and Africa show promising growth opportunities, fueled by rising disposable incomes and increasing adoption of smartphones and other consumer electronics. Continued technological advancements, particularly in 5G and AI-enabled devices, are expected to further stimulate HDI PCB demand in the coming years. Companies are focusing on providing customized solutions and expanding their manufacturing capacity to cater to the specific needs of their customer base across different regions.

In 2021, Ghana scored 0.63 on the Human Development Index (HDI), which indicated a medium level of development. The country experienced a steady increase in the index from 2000 onwards. However, it remained between the medium and low indicators of human development.